BZ: https://bugzilla.tianocore.org/show_bug.cgi?id=1748 

> -----Original Message-----
> From: Gao, Liming
> Sent: Wednesday, April 24, 2019 12:22 AM
> To: devel@edk2.groups.io; Kubacki, Michael A
> <michael.a.kuba...@intel.com>
> Subject: RE: [edk2-platforms] [RFC] Migrate devel-MinPlatform branch to
> master branch
> 
> Michael:
>   I think this change is good. Could you submit one BZ for it?
> 
> Thanks
> Liming
> >-----Original Message-----
> >From: devel@edk2.groups.io [mailto:devel@edk2.groups.io] On Behalf Of
> >Kubacki, Michael A
> >Sent: Friday, April 19, 2019 5:12 AM
> >To: 'devel@edk2.groups.io' <devel@edk2.groups.io>
> >Subject: [edk2-devel] [edk2-platforms] [RFC] Migrate devel-MinPlatform
> >branch to master branch
> >
> >Hello,
> >
> >This RFC proposes moving the content on the devel-MinPlatform branch in
> >the edk2-platforms repository to the master branch in the
> >edk2-platforms repository.
> >
> >The devel-MinPlatform branch has been used for the initial development
> >of an EDK II based platform design referred to as "Minimum Platform".
> >This design is intended to provide a structured approach to introducing
> >Intel platform code into open source in a consistent manner.
> >
> >For more information about the EDK II Minimum Platform, please refer to
> >the Readme.md in devel-MinPlatform.
> >https://github.com/tianocore/edk2-platforms/blob/devel-
> >MinPlatform/ReadMe.md
> >
> >The following packages would be added in Platform/Intel:
> >  * Generic packages:
> >     * AdvancedFeaturePkg
> >     * MinPlatformPkg
> >  * Board-specific packages:
> >     * ClevoOpenBoardPkg
> >     * KabylakeOpenBoardPkg
> >     * PurleyOpenBoardPkg
> >
> >The following packages would be added in Silicon/Intel:
> > * KabylakeSiliconPkg
> > * LewisburgPkg
> > * PurleyRcPkg
> > * PurleySktPkg
> >
> >The following growth is expected over time:
> > * Platform/Intel - Additional board packages for Intel reference boards
> >    including support for some pre-existing product releases
> > * AdvancedFeaturePkg - Additional modular features capable of being used
> >    in board packages
> > * Silicon/Intel - Additional silicon packages roughly keeping 1:1 parity
> >    with board packages
> >
> >We hope the content will enable others to add new board packages and
> >advanced features over time.
> >
> >The result of the change is available here for reference:
> >https://github.com/lgao4/edk2-platforms
> >
> >Regards,
> >Michael
> >
> >


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