On 9/21/2023 7:10 AM, Chaoyong He wrote: > From: Long Wu <long...@corigine.com> > > DPDK bonding PMD mixing use 'bonded' and 'bonding' currently, this > patch replaces the usage of the word 'bonded' with more appropriate > word 'bonding' in bonding PMD as well as in its docs. Also the test > app and testpmd were modified to use the new wording. > > In addition to grammar requirements, we should still use bonded, > and in other cases, we should use bonding. > > Signed-off-by: Long Wu <long...@corigine.com> > Reviewed-by: Chaoyong He <chaoyong...@corigine.com> > Reviewed-by: James Hershaw <james.hers...@corigine.com> > --- > v2: > * Rebase to the latest commits.
Thanks for the rebase. Acked-by: Ferruh Yigit <ferruh.yi...@amd.com> Applied to dpdk-next-net/main, thanks. <...> > @@ -505,17 +505,17 @@ Testpmd driver specific commands > > Some bonding driver specific features are integrated in testpmd. > > -create bonded device > +create bonding device > ~~~~~~~~~~~~~~~~~~~~ > This gives warning, will fix while merging. link_bonding_poll_mode_drv_lib.rst:509: WARNING: Title underline too short.
