> -----Original Message-----
> From: Kaiwen Deng <kaiwenx.d...@intel.com>
> Sent: Friday, March 10, 2023 12:42 PM
> To: dev@dpdk.org
> Cc: sta...@dpdk.org; Yang, Qiming <qiming.y...@intel.com>; Zhou, YidingX
> <yidingx.z...@intel.com>; Deng, KaiwenX <kaiwenx.d...@intel.com>;
> Chas Williams <ch...@att.com>; Min Hu (Connor) <humi...@huawei.com>;
> Tomasz Kulasek <tomaszx.kula...@intel.com>; Doherty, Declan
> <declan.dohe...@intel.com>
> Subject: [PATCH] net/bonding: fix forward packets failed
>
> The bond port is failed to forward packets in Link Aggregation
> 802.3AD(4) mode. Because bond devices get LACP packets from rx_ring
> instead of tx_ring.
>
> This commit will get LACP packets from tx_ring instead.
>
> Fixes: 112891cd27e5 ("net/bonding: add dedicated HW queues for LACP
> control")
> Cc: sta...@dpdk.org
>
> Signed-off-by: Kaiwen Deng <kaiwenx.d...@intel.com>
> ---
Tested-by: Song Jiale <songx.ji...@intel.com>
