On Wed, 13 Apr 2022 17:03:07 +0800 "Min Hu (Connor)" <humi...@huawei.com> wrote:
> Hi, Stephen, > > 在 2022/4/12 23:19, Stephen Hemminger 写道: > > On Mon, 11 Apr 2022 03:06:46 +0000 > > "Zhang, Ke1X" <ke1x.zh...@intel.com> wrote: > > > >> This is a coding waring as below: > >> > >> _coding style issues_ > >> > >> WARNING:TYPO_SPELLING: 'slave' may be misspelled - perhaps 'secondary'? > >> #64: > >> when creating a bonding device, if the slave device's rss key length > >> > >> WARNING:TYPO_SPELLING: 'slave' may be misspelled - perhaps 'secondary'? > >> #65: > >> is 52, then bonding device will be same as slave, in function > >> > >> total: 0 errors, 2 warnings, 0 checks, 19 lines checked > >> > >> the 'slave' is correct, for exsample, testpmd cmd: > >> add bonding slave 0 2 > > > > Just a heads up, for 22.11 I plan to replace/deprecate use of master/slave > > terminology in bonding driver. The terms master/slave are legacy and most > > commercial products have switched to the terms from the 802 standard. > What are the terms ? Could you show them for us? The current IEEE std is https://standards.ieee.org/ieee/802.1AX/6768/ which is unfortunately paywalled. The terms in standard are "Aggregator Client" for the ports used in the device and "Aggregator Partner/Multiplexor" but they are not quite the same. Probably going to use client and multiplexor as terms; but open for discussion.
