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CALL FOR CONTRIBUTIONS
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EXTENDED SUBMISSION DEADLINE: MAY 28, 2010
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The 2010 Conference on Design and Architectures
for Signal and Image Processing (DASIP)
26-28 October 2010
Edinburgh, United Kingdom
Details on author schedules, submission, registration, program and venue
are available on the conference website:
http://www.ecsi.org/dasip
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Call for Papers
The historical city of Edinburgh, the capital of Scotland and home to some
half a million people, will host the 2010 Conference on Design and
Architectures for Signal and Image Processing (DASIP) from the 26th to the
28th of October 2010. DASIP provides an inspiring international forum for
latest innovations and developments in the field of leading edge embedded
signal processing systems. Prospective authors are invited to submit
manuscripts on topics including, but not limited to:
Design methods and tools
- Design verification and fault tolerance
- Embedded system security and security validation
- System-level design and hardware/software co-design
- Communication synthesis, architectural and logic synthesis
- Embedded real-time systems and real-time operating systems
- Rapid system prototyping, performance analysis and estimation
- Formal models, transformations, algorithm transformations and metrics
Development platforms, architectures and technologies
- Embedded platforms for multimedia and telecom
- Many-core and multi-processor systems, SoCs, and NoCs
- Reconfigurable ASIPs, FPGAs, and dynamically reconfigurable systems
- Asynchronous (self-timed) circuits and analog and mixed-signal circuits
- Digital biosignal processing, biologically based and/or inspired systems
Use-cases and applications
- Ambient intelligence, ubiquitous and wearable computing
- Global navigation satellite systems, smart cameras, and PDAs
- Security systems, cryptography, object recognition and tracking
- Embedded systems for automotive, aerospace, and health applications
Smart sensing systems
- Sensor networks, environmental and system monitoring
- Vision, audio, fingerprint, health monitoring, and biosensors
- Structurally-embedded, distributed, and multiplexed sensors
- Sensing for active control systems, adaptive and evolutionary sensors
The conference program will include keynote speeches, contributed paper
sessions, and demonstrations. DASIP 2010 will feature Special Sessions
that will run throughout the conference. These Special Sessions have the
purpose of introducing the DASIP community to relevant hot topics that
were not sufficiently covered by previous editions of the conference.
The sessions can also continue with a special topic from former editions
of DASIP providing for a continued exchange of ideas and a place to meet.
Five Special Sessions are planned. Prospective authors are invited to
submit manuscripts on the following topics:
- Reliable Multi-Processor Scheduling and HW/SW Resource Management
- Reconfigurable Computing Architectures
- Image and Signal Processing on GPU
- Advances in Reconfigurable Video Coding (RVC)
- Smart Image Sensors
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Authors should submit their full papers (up to 8 pages, double-column IEEE
format) in PDF through the web based submission system. Proceedings of
DASIP 2010 will be included in the IEEE Xplore Digital Library. Authors of
the best papers will be invited to submit an extended version of their work
to the International Journal of Embedded and Real-Time Communication
Systems (IJERTCS), in which a special issue on DASIP will be published on
the third quarter of 2011.
All submitted papers should be done online, following the paper submission
guidelines.
For those interested in submitting a paper for one of the special sessions,
please take care to select the special session corresponding to your
choice.
http://www.ecsi.org/dasip/submissions
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Important Dates
Paper Submission: May 28, 2010
Acceptance Notification: July 15, 2010
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Steering Committee
Mohamed Abid, Ecole nationale d'ingénieurs de Sfax, TN
Ahmet Erdogan, University of Edinburgh, UK
Guy Gogniat, Université de Bretagne Sud, FR
Bertrand Granado, Ecole Nationale Supérieure de l'Electronique et de ses
Applications, FR
Jean-Didier Legat, Université catholique de Louvain, BE
Stéphane Mancini, Institut polytechnique de Grenoble, FR
Marco Mattavelli, Ecole Polytechnique Fédérale de Lausanne, CH
Dragomir Milojevic, Université Libre de Bruxelles, BE
Adam Morawiec, Electronic Chips & Systems design Initiative, FR
Michel Paindavoine, Université de Bourgogne, FR
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Organizing Committee
General Chair:
Tughrul Arslan, University of Edinburgh, UK
Program Co-Chairs:
Tapani Ahonen, Tampere University of Technology, FI
Jean-François Nezan, Institut National des Sciences Appliquées Rennes, FR
List of PC Members is Available at:
http://www.ecsi.org/dasip
Local Organizer:
The University of Edinburgh/School of Engineering
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Secretariat
ECSI Office
off...@ecsi.org
Ph: +33 4 76 63 49 34
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